JPH044753B2 - - Google Patents

Info

Publication number
JPH044753B2
JPH044753B2 JP57004422A JP442282A JPH044753B2 JP H044753 B2 JPH044753 B2 JP H044753B2 JP 57004422 A JP57004422 A JP 57004422A JP 442282 A JP442282 A JP 442282A JP H044753 B2 JPH044753 B2 JP H044753B2
Authority
JP
Japan
Prior art keywords
package
cap
metal cap
radio waves
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57004422A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122759A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP442282A priority Critical patent/JPS58122759A/ja
Publication of JPS58122759A publication Critical patent/JPS58122759A/ja
Publication of JPH044753B2 publication Critical patent/JPH044753B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP442282A 1982-01-14 1982-01-14 半導体装置 Granted JPS58122759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP442282A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP442282A JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122759A JPS58122759A (ja) 1983-07-21
JPH044753B2 true JPH044753B2 (en]) 1992-01-29

Family

ID=11583827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP442282A Granted JPS58122759A (ja) 1982-01-14 1982-01-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122759A (en])

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121653U (ja) * 1984-01-27 1985-08-16 株式会社東芝 半導体装置の外囲器
JPS60180852A (ja) * 1984-02-28 1985-09-14 Kyocera Corp 熱印刷装置
JPS60163751U (ja) * 1984-04-04 1985-10-30 スタンレー電気株式会社 半導体装置
JPS61114564A (ja) * 1984-11-09 1986-06-02 Nec Corp 静電破壊防止機構付きｉｃパツケ−ジ
JPS61195067U (en]) * 1985-05-24 1986-12-04
JPS6230356U (en]) * 1985-08-07 1987-02-24
FR2774810B1 (fr) * 1998-02-10 2003-06-06 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111325Y2 (en]) * 1971-11-22 1976-03-26
JPS51138165A (en) * 1975-05-23 1976-11-29 Mitsubishi Electric Corp Package stracture for thermal resistance and shield

Also Published As

Publication number Publication date
JPS58122759A (ja) 1983-07-21

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